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Electronics Engineering Summer Intern (3 Tracks)

  • Hybrid
    • Cairo, Al Qāhirah, Egypt
  • Sensor Systems Technology

Job description

At Si-Ware Systems, we are shifting the boundaries of optical spectroscopy and advanced electronics. Our team designs and manufactures cutting-edge  spectrometers and high-performance hardware solutions. We are looking for three motivated, final-year undergraduate interns to join our electronics team and help optimize our current product 's PCB workflow.

Role Overview

Instead of just giving you theoretical exercises, you will dive straight into our existing hardware. Your workflow will be practical: analyze real-world challenges in our current projects, model the issues, and solve them using available simulation tools.

Choose Your Track:

Track 1: Signal Integrity (SI) Intern

Focus: Managing high-speed data transmission and mixed-signal environments.

  • Key Responsibilities:

    • Analyze existing board layouts to identify and mitigate crosstalk and signal degradation.

    • Work on impedance control and the modeling of PCB stackup to ensure clean signal paths.

    • Evaluate routing challenges for high-speed signal designs and analog-digital mixed-signal circuits.

  • What We Are Looking For:

    • Strong foundational knowledge of transmission line theory and electromagnetic basics.

    • Understanding of how high-frequency signals behave on a PCB layout.

Track 2: Power Integrity (PI) & PCB Thermal Management Intern

Focus: Ensuring stable power distribution and efficient heat dissipation.

  • Key Responsibilities:

    • Analyze current hardware designs to identify power distribution bottlenecks and voltage drops (IR drop).

    • Model the board’s thermal behavior to spot localized hotspots caused by power consumption.

    • Propose practical modifications (like thermal vias or optimized copper pouring) using available simulation tools to keep the system running cool.

  • What We Are Looking For:

    • Solid understanding of DC/AC circuit analysis and basic thermodynamics/heat transfer.

    • Interest in how power delivery directly impacts physical board temperature.

Track 3: Product EMC Intern

Focus: Debugging electromagnetic compatibility and building testing setups.

  • Key Responsibilities:

    • Develop and review real-world case studies based on our current products to understand electromagnetic interference (EMI) challenges.

    • Take a hands-on role in developing our in-house lab capabilities for EMC debugging and measurements.

    • Assist in setting up test benches and documenting measurement procedures for emissions and immunity.

  • What We Are Looking For:

    • A strong interest in RF principles, shielding, and grounding concepts.

    • A "maker" mindset—you enjoy working with lab equipment and setting up test hardware from scratch.

Job requirements

  • Currently pursuing a B.Sc. in Electrical/Electronics Engineering (must be in your final year or actively working on a graduation project topic).

  • Strong grasp of engineering fundamentals (circuit theory, electronics, and basic electromagnetics) over specific software knowledge.

  • Eagerness to learn: you should be comfortable taking a problem, researching it, and learning how to use the available simulation tools to solve it.

  • Comfortable working in an electronics lab environment with standard tools (oscilloscopes, multimeters).

  • Good documentation skills to help map out your findings and lab setups.

What You Will Gain

  • Real Product Impact: You will directly improve the workflow, thermal reliability, and compliance of actual commercial products.  

  • Tool Agnostic Problem-Solving: You will learn how to think like a hardware engineer, a skill that translates to any simulation or design software you use in the future.

  • Mentorship: Work side-by-side with seasoned hardware engineers who are eager to share their expertise.  

  • Lab Building Experience:  The unique opportunity to say you helped build out an engineering company's in-house testing capabilities.


How to Apply & Selection Process

  1. Submit Your Application: Please submit your resume and a brief note mentioning which track aligns with your studies or interests (Track 1: SI, Track 2: PI & Thermal, or Track 3: Product EMC). If you are looking to tie this directly to your university graduation project, please let us know!

  2. Shortlisting Phase: If your profile matches our requirements, you will be required to prepare a short presentation on a topic related to your selected track as a part of the shortlisting and selection phase. This will help us evaluate your problem-solving approach and foundational knowledge.

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